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Wafer fabrication
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21	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden YEARS Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2016-05-25 07:28:49 Semiconductor device fabrication Integrated circuits Electronic engineering Electronics Electromagnetism Packaging Three-dimensional integrated circuit Through-silicon via Fraunhofer Society Wafer backgrinding Wafer
22	PRODUCT INFORMATION SMART AUTOMATION FOR SEMICONDUCTOR FABS INVEST IN MOVEMENT, NOT STORAGE Add to Reading List Source URL: www.intellion.com Language: English - Date: 2008-03-06 03:49:59 Semiconductor device fabrication Semiconductor fabrication plant Wafer
23	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2016-08-19 15:01:56 Semiconductor device fabrication Integrated circuits Packaging Microtechnology Electronics manufacturing Three-dimensional integrated circuit Through-silicon via Microelectromechanical systems Wafer-level packaging Wafer Chip-scale package System in package
24	A Practical Guide to MEMS Inertial Sensors Stanford PNT Symposium Alissa M. Fitzgerald, Ph.D. \| 14 November10th Add to Reading List Source URL: scpnt.stanford.edu Language: English - Date: 2013-11-20 20:27:34 Microtechnology Semiconductor device fabrication Aircraft instruments Mechanical engineering Microelectromechanical systems Transducers Inertial measurement unit Wafer Die
25	FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS IPMS CENTER NANOELECTRONIC TECHNOLOGIES (CNT) INTERCONNECTS HIGH-K DEVICES Add to Reading List Source URL: www.ipms.fraunhofer.de Language: English - Date: 2016-04-01 03:01:20 Semiconductor device fabrication Copper interconnect Chemical-mechanical planarization Plating GlobalFoundries Wafer Back end of line Fraunhofer Society Copper plating Silicon Saxony
26	Heterogeneously Integrated Optoelectronic Devices Enabled by Micro‐Transfer Printing Add to Reading List Source URL: rogers.matse.illinois.edu Language: English - Date: 2015-10-26 09:45:23 Solar cells Energy conversion Semiconductor devices Crystals Semiconductor device fabrication Gallium arsenide Crystalline silicon Photovoltaics Wafer Indium gallium arsenide Multi-junction solar cell Black silicon
27	General Use (Self‐Checkout by SNF Labmembers) ‐ Page 1 Badger Name AFM Tip ‐ DNP‐20 AFM Tip ‐ TESP Amber Bottle (4 Add to Reading List Source URL: snf.stanford.edu Language: English - Date: 2016-04-11 15:29:03 Semiconductor device fabrication Cleanroom Wafer
28	Produktblatt_CMP2016.indd Add to Reading List Source URL: www.screening-fab.com Language: English - Date: 2016-06-30 03:47:51 Semiconductor device fabrication Wafer KLA-Tencor Etching Applied Materials Silicon Saxony
29	Produktblatt_Cleaning2016.indd Add to Reading List Source URL: www.ipms.fraunhofer.de Language: English - Date: 2016-06-30 03:44:06 Semiconductor device fabrication Wafer KLA-Tencor Fraunhofer Society
30	Copy of Session Schedule Combined Master.xlsx Add to Reading List Source URL: www.iwlpc.com Language: English - Date: 2016-08-15 13:37:41 Semiconductor device fabrication Integrated circuits Packaging Microtechnology Wafer-level packaging Three-dimensional integrated circuit Embedded Wafer Level Ball Grid Array SUSS MicroTec System in package Chip-scale package Through-silicon via Microelectromechanical systems